Plasma Etching & Gas Abatement

Plasma dry etching is one of the most critical steps in the manufacturing of semiconductor devices. Pattern definition and mask transfer into poly-silsicon gate materials, dielectric layers and metal films are mandatory in a production lie to achieve the electron circuit architecture suitable for any kind of semiconductor devices. The increasing demand of more aggressive performance for memory cells and logic chips (integrated switching circuits) is pushing the etching technology well below 0.1µm critical dimensions. Therefore, highest precision and extraordinary reliability belong to the standard.

Our innovative etching process modules are the ideal instruments for covering almost the complete spectrum of the possible etch applications commonly adopted in the semiconductor industry.

Plasma Dry Etch

Catalytical Abatement System